Assalamu alaikum, nine editan.Duban gwajin mahaɗin allo-to-board.Mu duba tare a kasa;
1. Lura cewa ƙarfin lantarki da aka ɗora akan mahaɗin allo-to-board bai kamata ya wuce 50% na ƙimar ƙarfinsa ba.
2. Girman shigarwa na allo-to-board don masu kunna kai, tsayin ƙafafun da aka siyar da su zuwa PCB yana buƙatar ɓangaren da aka fallasa na PCB ya fi 0.5mm.
3. Domin high-daidaici board-to-board haši, da model tare da sakawa fil ya kamata a zaba har zuwa yiwu a lokacin da PCB sarari izni, wanda ya dace da manual soldering.
4. Bincika idan akwai zane mai hana wauta.
5. Bincika ko kayan da aka yi amfani da su a cikin mahaɗin allo zuwa allo sun ƙunshi gubar.
6. Ƙananan ƙananan ƙananan katako na katako, tare da ƙananan matsi na lamba, da ƙananan halin yanzu da aikace-aikacen wutar lantarki, ana bada shawarar yin amfani da masu haɗin gwal-plated zinariya ko azurfa don kauce wa juriya na fim daga tasiri sigina.
7. Kula da tsawo daga cikin allo-to-board connector bayan jima'i, da kuma ko ya hadu da soldering tsawo na aka gyara a kusa da PCB.Dole ne tsayin mating ɗin ya fi tsayin siyar da abubuwan da ke kewaye da PCB, kuma tabbatar da cewa akwai wani yanki don tabbatar da cewa babu tsangwama.Musamman hankali ya kamata a biya ga yiwu tsawo kurakurai na aka gyara bayan PCB soldering.
FIN KAYAN MACE:1.27MM(.050″) ROW SMD
Lokacin aikawa: Satumba 11-2020
