Abavelisi bokudibanisa ibhodi ukuya kwibhodi batolika iimpawu zobugcisa bebhodi ukuya kwibhodi

1. Okokuqala, "i-soft", uxhulumaniso oluguquguqukayo, ukufakwa ngokukhawuleza, ukuchithwa kunye nokufanelekileyo.

2. Ukuphakama kwe-ultra-low kwebhodi-to-ibhodi yokudibanisa ukufezekisa injongo yokunciphisa ubukhulu be-fuselage.

CJT 1.0 ibhodi ukuya ibhodi isinxibelelanisi

3. Isakhiwo soqhagamshelwano sinokumelana nokusingqongileyo okuphezulu, kungekhona nje ukuguquguquka, kodwa kwakhona ukhetha "uxhulumaniso oludibeneyo" kunye nokuthembeka okuphezulu kokuthintela ukuphucula amandla adibeneyo ekhonkco kunye neplagi.Kulula ukukhetha iindawo zetsimbi ezisisigxina kunye neendawo zoqhagamshelwano.Umbutho wokutshixa, kunye nokuphuculwa kwamandla adityanisiweyo, kwenza ukuba ixesha lokuvala livaleleke ngakumbi.

I-PIN HEADER PITCH:1.0MM(.039″) UHLOBO LWEMIQEZO EMIBINI

4. Ukuze kuhlangatyezwane neemfuno zenkqubo ye-SMT, indawo yokuwelda i-terminal yayo yonke imveliso ifuneka ngokungqongqo ukuba ibe ne-coplanarity ebalaseleyo.

5. I-ultra-namxinano yebhodi-to-ibhodi isixhumi sibeka phambili iimfuno ezintsha zenkqubo ye-electroplating.Indlela yokuqinisekisa ukuba ubukhulu begolide yemveliso kunye nefuthe le-tinning ayinyuki i-tin, ibe yeyona ngxaki ibalulekileyo kwi-miniaturization ye-connector.

Jane Bull DIP Isidibanisi

6. Ibhodi-to-ibhodi isinxibelelanisi inokwakhelwa uyilo olulula umatshini isekethe.Ngokubonelela ngodonga olukhuselayo kumphezulu osezantsi wekhonkco, ibhodi ye-PCB ilandelela kunye neetheminali zetsimbi zinokuhanjiswa kwaye zifakwe kwiintambo kumphezulu ophantsi wesidibanisi ngaphandle kokuchukumisa, ezifanelekileyo kwi-miniaturization yebhodi ye-PCB.

7. Ukuhlanganiswa kwesikhokelo senkqubo, kunye nokuphuhliswa kweminyaka, i-micro-connectors eninzi isetyenzisiweyo, ngoko ke xa kuhlanganiswa, kuyimfuneko ukulungelelanisa imbono yokuqalisa, kwaye emva koko uyicinezele ngamandla, ukwenzela ukukhusela imveliso ukusuka. ukwenziwa ngokukhutshwa kunye nokucinezela umonakalo