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Izici zesakhiwo kanye nemisebenzi yezixhumi zezintambo eziya ebhodini

Kusixhumi sentambo ukuya ebhodini, isisekelo sokuvikela sesixhumi sinikezwe umsele wokwamukela ucingo ukuze ucingo olusethiwe lubekwe futhi lubekwe endaweni,futhi ijoyinti lokubopha ngesixhumi sangaphandle kwakheka ohlangothini olulodwa lwesisekelo se-insulating, futhi ubuningi bezixhumi buhlinzekwa ekuhlanganyeleni.Kunamatheminali amabili okuthintana amiswe nxazonke, futhi umkhawulo owodwa wetheminali ngayinye yokuxhumana uhlinzekwa ngengxenye yokushisela edlula kusisekelo se-insulating iye endaweni eyamukela ucingo futhi ixhunywe ngocingo olusethiwe, olubonakala ngokuthi ubuningi bamatheminali okuxhumana avundlile. Umumo ongu-U , Iphansi letheminali ngayinye yokuxhumana ihlinzekwa ngengxenye yokushisela ebangeni elide ebekwe endaweni engaphakathi ye-groove eyamukela ucingo, futhi itheminali yokuxhumana nayo inikezwa ingxenye yokuxhumana egobele phezulu nehlehlayo futhi ezungeze umngcele. yesixhumi.Ukuxhumana kwe-Welding.Ngalo mklamo wesakhiwo, ukuphakama kwesixhumi kungancishiswa ngokuphumelelayo, amatheminali okuxhumana ahlanganiswe ngokuqinile, indawo yokuxhumana ilula ukuyiqonda, umphumela wokuxhumana muhle, futhi umphumela we-impedance ephansi ungafinyelelwa.

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Lapho ibhodi lesifunda eliphrintiwe ohlelweni kanye nempahla ye-elekthronikhi ithola/idlulisela amandla okukhipha isignali, idinga ukuxhunywa ngaphandle kwe-substrate.Ezimweni eziningi, kukhona ibanga elithile phakathi kwebhodi lesifunda eliphrintiwe kanye ne-substrate, okudinga izintambo ukuxhuma.Ukuxhumana okude kungafinyelelwa ngezintambo ezihlanganisiwe ku-substrate.Kodwa-ke, ngokucatshangelwa kokusebenza, izixhumi ze-wire-to-board ezinamaphini amaningi zivame ukusetshenziselwa ukuxhumana.
Isakhiwo sesixhumi se-wire-to-board silula kakhulu: beka ama-electrodes (othintana nabo) kugobolondo (igobolondo leplastiki).Kunezinhlobo ezimbili zoxhumana nabo: induku noma i-chip “plug” kanye “nesokhethi”.Cindezela ipulaki ngokuphelele esokhethi bese umboza ukuze uzuze "ukufanisa".Ngokuvamile, isokhethi ixhunywe ocingweni futhi ipulaki ixhunywe ku-substrate, kodwa lokhu kungahlehliswa kuye ngokusetshenziswa.Ukuxhumeka kwezintambo kanye noxhumana nabo ngokuvamile kufinyelelwa ngokusebenzisa ubuchwepheshe be-"pressure bonding", njengama-terminal crimp.Ungasebenzisa futhi "i-pressure welding" ukuxhuma izintambo noxhumana nabo.Ubuchwepheshe be-pressure welding busetshenziselwa ukuxhumana okuphansi kwamanje, okuvumela ukuxhumeka okugcwele ngokumane uxhume izintambo eziboshiwe koxhumana nabo.Nakuba le ndlela ifanelekile, ukuqina kungase kuncishiswe.Ubuchwepheshe obubili obungenhla bungagwema ukushisa okubangelwa ubuchwepheshe be-soldering futhi buvikele uxhumano emonakalweni.Ngaphezu kwalokho, njengoba indawo yokuxhumana engenawo umoya ingabonakali emoyeni, ukuxhumana kungagcinwa kuzinzile.


Isikhathi sokuthumela: Aug-19-2020
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