Qonda ukuhlolwa kokuhlolwa kwesixhumi sebhodi ukuya ebhodini

Sanibonani nonke, yimina mhleli.Ukuhlolwa kokuhlolwa kwesixhumi sebhodi ukuya ebhodini.Ake sibheke ndawonye ngezansi;

1. Qaphela ukuthi i-voltage elayishwe kusixhumi sebhodi ukuya ebhodini akufanele idlule u-50% wevoltheji yayo elinganiselwe.

2. Usayizi wokufaka wesixhumi sebhodi ukuya ebhodini Kuzihloko zepulaki, ubude bezinyawo ezisodayo ezidayiselwe ku-PCB budinga ukuthi ingxenye eveziwe ye-PCB ibe nkulu kuno-0.5mm.

3. Ezixhunyweni zebhodi ukuya ebhodini ezinembayo eziphezulu, imodeli enezikhonkwane zokubeka indawo kufanele ikhethwe ngokusemandleni lapho isikhala se-PCB sivuma, okulungele ukusoda ngesandla.

4. Hlola ukuthi ukhona yini umklamo ongenangqondo.

5. Hlola ukuthi impahla esetshenziswe kusixhumi sebhodi ukuya ebhodini iqukethe yini umthofu.

6. Izixhumi zebhodi ukuya ebhodini ezinosayizi omncane, ezinengcindezi yokuxhumana ephansi, kanye nezicelo eziphansi zamanje kanye ne-voltage, kunconywa ukuthi kusetshenziswe izixhumi ezifakwe ngegolide noma zesiliva ukuze ugweme ukumelana nefilimu ekuthinteni amasignali.

7. Qaphela ukuphakama kwesixhumi sebhodi ukuya ebhodini ngemva kokukhwelana, nokuthi siyahlangabezana yini nokuphakama kokusoda kwezingxenye ezizungeze i-PCB.Ubude bokukhwelana kufanele bube bukhulu kunobude bokunamathisela bezingxenye ezizungeze i-PCB, futhi kuqinisekiswe ukuthi kukhona imajini ethile ukuqinisekisa ukuthi akukho ukuphazamiseka okwenzekayo.Ukunakwa okukhethekile kufanele kukhokhwe emaphutheni okuphakama okungenzeka ezingxenyeni ngemuva kwe-PCB soldering.

INHLOKO YESIFAZANE:1.27MM(.050″) UROW OWODWA SMD